product family : high pow er chip resistor constr ucti on : ? 99.5% beo or 99.6% al um ina ceram i c ? nick el allo y t h in film resistiv e ele m en t ? ep oxy - r esi n o v e rcoat ? pre-tinn e d (sn1 00 , m a t t e) termin atio n s ove r ni bar r i e r features : ? tcr?s to 25p p m ? to leran ces less th an 1 % ? c u st om and st anda r d si zes a v ai l a bl e ? hi g h vol um e pro d u ct i o n , s u i t a bl e f o r commercial and s p ecial applications description : these p o we r r e si st ors a r e des i gne d t o t o l e rat e hi g h c u rre nt and estab lish a lo w t h erm a l resistan ce in terface with t h e circu it b o a rd . a lo wer th erm a l resistan ce m o re efficien tly si nks h eat t o t h e boa r d , e n a b l i n g a l a rge r e ffec tive area for he at dissipation. as a resu lt, m u ch lowe r s u rface tem p eratures are achie vabl e in c o m p arison to sta nda rd c h ip resist ors for t h e sam e chip size and a p plied powe r. the bp series effectively inte grates t h e p o wer resisto r with th e b o a rd , p r ov id ing a th ermal resistan ce com p arab le with alu m in u m heat-sinks . dimensions : siz e d i m e n s i o n s ( m m ) in ch m e t r i c l w h t-top t-b t m 25 1 2 63 3 2 6. 3 0. 2 3. 2 0. 2 1. 1 0. 1 (b p) 0. 7 0 . 1 (c p ) 0. 9 0. 2 2. 0 0. 2 25 2 5 63 6 3 6. 3 0. 2 6. 3 0. 2 1. 1 0. 1 (b p) 0. 7 0 . 1 (c p ) 0. 9 0. 2 2. 0 0. 2 c a l l for ot her s i zes electrical s p ecifications : derating curve : size: inch (m etric) 2 512 ( 633 2) 2 525 ( 636 3) rated po wer at 70 oc 1 (beo ) up to 5 w 1 up to 8 w 1 rated po wer at 70 oc 1 (al u m i na) up to 2 w 1 up to 3 w 1 rated vo ltag e (p xr) resistance t o lerance 1 to 5% resistance val u es 5 to 200 ? , call for oth e r values tcr (pp m /oc) 2 25 t o 2 00 ope r ating tem p erat ure ra nge 3 -5 5 t o 15 0oc in su latio n resistan ce (10 0 v, 1 m in ) 4 > 1g ? notes : 1 . dep e nd en t on effectiv e th erm a l co ndu ctiv ity of b o a rd con s t r u c tion /land d e sig n and size of b o a rd - greater p o wer cap ab i lity f or b o a rd /lan d wit h lower th erm a l resistan ce. fo r relativ ely h i g h the r m a l resistance m ountings, t h e powe r resistors a r e ca pable of refl o w i n g sol d er bo n d s bef o r e de vi ce d a m a ge occu rs. 2. per m i l-pr f- 55 3 4 2 ( - 5 5 / 2 5/ 12 5oc ) . 3. per m i l-pr f- 55 3 4 2 , see de r a t i ng c u r v e. 4 . per i e c 6 011 5- 1.
environmental perfo r mance specifications : test refere nce conditi ons of test requireme nt lif e m i l- prf-5 534 2 , mi l- std- 202 meth od 1 08a 7 0 oc, 20 00h , rated pow er, 1 . 5 h on , 0.5h of f 0 . 5 % + 0 . 01 ? th er m a l sh ock mi l- prf-5 534 2, mi l- std- 202 meth od 1 07g co nd itio n f-3 , -65 o c/0.25h to 1 5 0 o c/ 0 . 2 5 h , 10 0 cycles 0 . 1 % + 0 . 01 ? hi g h tem p erat ure ex p o s u re m i l-pr f - 55 3 42 15 0oc , 10 0 h 0. 1% + 0. 0 1 ? sh ort ti m e ov erl o a d m i l-pr f - 55 3 42 6. 25 x rat e d p o w er , 5 sec. 0. 1% + 0. 0 1 ? mo istu re resistan c e m i l- prf-5 534 2 , mi l- std- 202 meth od 1 06g 25/ 65/ 25/ 65/ 25 / ? 1 0 oc , 9 0 % t o 9 8 %r h , 10 c y cl es, 24 h/ cy cl e, wi t h a n d wi t h o u t bi as, bi as = 1. 5 h on , 0. 5h of f @ 1/ 1 0 th r a ted pow er 0. 1% + 0. 0 1 ? resistance to solde r ing heat 1 mi l- prf-5 534 2, mi l- std- 202 m e t h o d 21 0f 26 0oc f o r 1 5 s ec., ove r 2 2 0 o c fo r 6 0 sec. , 3 cy cl es 0. 1% + 0. 0 1 ? so ld erab ility 2 mi l- prf-5 534 2, mi l- std- 202 meth od 2 08h preco n d itio n e: 1 5 0 o c dry b a k e for 1 6 h , meth od 1 ?d ip and loo k test ?, 245 oc, 5 sec., pb -f ree ( s nag c u) so l d er min 95 % cove ra ge of critical area bo ard flex i e c 6 011 5- 1 / ji s c 52 02 b e nd am ount o f 3m m , m easur em ent s d u ri n g and aft e r ben d 0. 1% + 0. 0 1 ? , no m echanical dam a ge term inal strength mil-prf - 55342 force o f 3k g fo r 30 sec. n o m e c h a n i c a l dam a ge notes : 1 . test con d ition s m o d i fied to rep r esen t th e h i gh tem p erat u r e pb -free reflow co nd itio ns an d an ex tra cycle i s add e d . 2 . jesd22 - b 1 02d ad d s test cond itio n s fo r pb -fr ee an d is aligned w ith j- std- 002 b r e f e r e n c ed in mi l- std - 2 0 2 met h od 20 8h . jesd22 -b 1 02d p r o c ed ure co m e s fro m eia-6 3 8 , ?su r face mou n t so l d erab ility test?. recommen d ed solder pad dimensions : dimensions (mm) size: metr ic (in ch) 2 512 ( 633 2) 2 525 ( 636 3) a 1 . 6 1. 6 b 7 . 7 7. 7 c 3 . 5 6. 7 n o tes on bo ard con s tru c tio n an d land d e sign : 1 . a m u lti-layer b o a rd with several groun d or p o wer p l an es sig n i fican tly redu ces t h erm a l resistan ce. 2. plated via hole s around the power resi stor further reduces therm a l resistance. 3 . max i mize lan d ar ea b e yond so ld er p a d ar ea in bo th w i d t h an d leng th t o f u r t h e r r e du ce ther m a l r e sistan ce. 4. optim iz ing t h e therm a l resistance of the board helps dissi pa te heat, e n a b ling higher power ha ndling a n d l o we r s u rface te m p eratures . part numbering : (e x. b p 25 1 2 s 27r 0 j ) b p 25 1 2 s 27r 0 j pr odu ct d e sign ator size, in ch t c r r e s i s t a n c e val u e tolera n c e bp fo r beo cp fo r al u m in a ref e r t o tab l e ab ov e e = 25 pp m / c h = 5 0 ppm /c k = 10 0 pp m/c s = 20 0 p p m / c ex. 27r 0 = 2 7 . 0 ? f = 1% g = 2% j = 5% thin film te chnology cor p ., 1 980 com m erce drive, north m ankato, m n 5600 3 , (507) 625- 8 445 www.thin-film.com
|
